by 3D ICs refer to three-dimensional integrated circuits where active devices are not just connected through 2D planes but also integrated in the third dimension to save space. 3D ICs allow stacking of different silicon layers or tiers containing CPUs, memory dies, sensors using through-silicon vias (TSVs) which help in vertical interconnects between the different tiers. This results in a significant reduction in interconnect length, small footprint and better signal propagation. The need for advanced packaging techniques is increasing due to the exponential growth in data generation, datacenters, and consumer electronics requiring higher processing power & storage capacity along with lower power consumption and cost.
The Global 3D ICs Market Demand is estimated to be valued at US$ 19511.73 Bn in 2024 and is expected to exhibit a CAGR of 12 % over the forecast period from 2024 to 2031.
Key Takeaways
Key players operating in the 3D ICs are Aquahydrex, Inc., MAN Energy Solutions, Electrochaea GmbH, ITM Power PLC, EXYTRON GmbH, Hydrogenics Corporation, Hitachi Zosen Corporation.
Key opportunities in the 3D IC market include growing demand for smartphones, networking applications, rise of IoT devices and use of 3D ICs in AI applications. The increased R&D in 3D integration technologies such as through-silicon vias (TSVs) and chip stacking is expected to improve the packaging densities.
Technological advancements in 3D integration technologies such as development of larger TSV diameters, wafer thinning, and wafer bonding are enabling higher throughput and sophistication of 3D ICs. New schemes for thermal management, optics integration, and fan-out wafer-level packaging (FOWLP) are furthering the capabilities of 3D ICs.
Market Drivers
The growing demand for powerful and compact consumer electronic devices such as smartphones, tablets, and wearable devices is driving the need for semiconductor technologies that allow stacking of different silicon dies to save space. Additionally, the increasing data volumes generated due to burgeoning connected devices is propelling the need for datacenter infrastructure, networking equipment and memory/storage products based on advanced 3D IC technologies.
Current Challenges in the 3D ICs Market
The 3D ICs market continues to face several technical challenges that hinder widespread adoption. Developing new techniques for stacking die and fabricating through-silicon vias (TSVs) at a higher density remains difficult and expensive. Thermal issues associated with removing heat from smaller, stacked chips need to be addressed through improved cooling solutions. Testing and debugging stacked components adds complexity that raises costs. Ensuring reliable electrical connections between die remains challenging. Developing design methodologies and EDA tools to effectively design and manufacture 3D ICs also requires more work. Overcoming these challenges would help drive down costs and allow 3D integration to be applied to a broader range of applications.
SWOT Analysis
Strength: 3D integration enables higher performance with smaller footprints and lower power consumption. Stacking die reduces interconnect delays and allows more transistors to be integrated at a lower cost per function.
Weakness: Fabrication is difficult and expensive, especially at advanced nodes. Thermal issues associated with tightly packed components must be solved.
Opportunity: Growing need for increased functionality in mobile devices and advanced packaging. Emerging applications in artificial intelligence, VR/AR and autonomous vehicles could drive widespread adoption.
Threats: 2.5D designs may meet many needs at a lower cost initially. Alternative high-performance computing approaches such as quantum computing could undermine market opportunities over the long run.
The United States currently accounts for the largest share of the global 3D ICs market in terms of value, driven by the strong presence of prominent players and ongoing R&D in the country. Asia Pacific is expected to grow at the fastest pace, led by government initiatives and investments in emerging technologies in countries such as China and South Korea. China in particular is focused on developing domestic 3D IC capabilities and presents a major growth opportunity. Growing demand for consumer electronics and mobile devices throughout the Asia Pacific region also supports market expansion.
The automotive industry offers significant potential as a growth area for the 3D ICs market. Autonomous vehicles will require hardware with advanced computing capabilities to power functions such as computer vision, advanced driver assistance systems and light detection and ranging (LiDAR). Integrating components in 3D with the space and power efficiency benefits it provides could help enable cost-effective electronics for autonomous vehicle applications looking ahead to the next decade.
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
